Overview:
HyperX HX316LC10FB/4 is a 512M x 64-bit (4GB) DDR3L-1600 CL10 SDRAM (Synchronous DRAM) 1Rx8, low voltage, memory module, based on eight 512M x 8-bit DDR3 FBGA components. Each module kit supports Intel Extreme Memory Profiles (Intel XMP) 2.0. This module has been tested to run at DDR3L-1600 at a low latency timing of 10-10-10 at 1.35V. Additional timing parameters are shown in the PnP Timing Parameters section below.
Features:
- JEDEC standard 1.35V and 1.5V Power Supply
- VDDQ = 1.35V and 1.5V
- 800MHz fCK for 1600Mb/sec/pin
- 8 independent internal bank
- Programmable CAS Latency: 11, 10, 9, 8, 7, 6
- Programmable Additive Latency: 0, CL – 2, or CL – 1 clock
- 8-bit pre-fetch
- Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not
- allow seamless read or write [either on the fly using A12 or MRS]
- Bi-directional Differential Data Strobe
- Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
- On Die Termination using ODT pin
- Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE ? 95°C
- Asynchronous Reset
- Height 1.291” (32.80mm) w/heatsink, single sided component
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